 |
Digi ConnectCore® 8X delivers a secure and cost-effective connected system-on-module platform that measures in at just 40 mm x 45 mm. The Digi SMTplus® surface mount form factor allows you to choose simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a versatile LGA option for ultimate design flexibility with access to virtually all interfaces.
Built on the NXP® i.MX 8X application processor
The module is the intelligent communication engine for today’s secure connected devices. Digi ConnectCore 8X can help jump-start the development of streaming video/audio devices, voice control and general human-machine interface solutions. With a multitude of high performance interconnecting options, including 1x USB 3.0 port, dual Gigabit Ethernet, PCIe 3.0, and pre-certified dual-band 2x2 MU-MIMO WLAN, ConnectCore 8X is ideal for developing a wide range of embedded and IoT applications.
|
SPECIFICATIONS
|
Digi ConnectCore® 8X
|
Digi ConnectCore® 8X Dual
|
|
APPLICATION PROCESSOR
|
NXP® i.MX8QuadXPlus
- 4x Cortex®-A35 cores @ 1.2 GHz
- 1x Cortex-M4F @ 266 MHz core for real-time processing
- 1x Tensilica® Hi-Fi 4 DSP
|
NXP® i.MX8DualXZ
- 2x Cortex®-A35 cores @ 1.2 GHz
|
|
MEMORY
|
Up to 64 GB eMMC, up to 4 GB of LPDDR4
|
|
PMIC
|
NXP PF8100
|
|
GRAPHICS
|
Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders
|
H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders
|
|
SECURITY
|
Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
|
|
PERIPHERALS/ INTERFACES**
|
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx,
8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG
|
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx,
8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),
4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG
|
|
ETHERNET
|
2x 10/100/1000M Ethernet + AVB
|
|
WI-FI
|
802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7
802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9
Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate.
Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
|
|
BLUETOOTH
|
Bluetooth® 5
|
|
ON-MODULE MICROCONTROLLER ASSIST
|
Digi Microcontroller Assist™
- Independent Cortex-M0+ microcontroller subsystem
- Supporting ultra-low power modes @ <3µA
|
|
OPERATING TEMPERATURE
|
Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)
|
|
STORAGE TEMPERATURE
|
-50° C to 125° C (-58° F to 257° F)
|
|
RELATIVE HUMIDITY
|
5% to 90% (non-condensing)
|
|
RADIO APPROVALS
|
US, Canada, EU, Japan, Australia/New Zealand
|
|
EMISSIONS/ IMMUNITY/ SAFETY
|
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3
|
|
DESIGN VERIFICATION
|
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
|
|
MECHANICAL DIMENSIONS
|
118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm
|
|
PRODUCT WARRANTY
|
3-year
|
|
|
|